The embodiments of the present invention provide a CMUT array and method
of fabricating the same. The CMUT array has CMUT elements individually or
respectively addressable from a backside of a substrate on which the CMUT
array is fabricated. In one embodiment, a CMUT array is formed on a front
side of a very high conductivity silicon substrate. Through wafer
trenches are etched into the substrate from the backside of the substrate
to electrically isolate individual CMUT elements formed on the front side
of the substrate. Electrodes are formed on the backside of the substrate
to individually address the CMUT elements through the substrate.