A fabrication method of a stacked chip structure is provided. Firstly, a
first conductive layer is formed on a first surface of a wafer.
Afterwards, a first patterned polymer layer is formed on the first
conductive layer, and a second patterned polymer layer is formed on a
second surface of the wafer. Next, a second conductive layer is
electroplated on the first conductive layer and is heated to form a
number of solder bumps. After that, the wafers are stacked on a substrate
structure. The first patterned polymer layer disposed on a first wafer of
the wafers is correspondingly connected to the second patterned polymer
layer on a second wafer of the wafers. The present invention is suitable
for the stacked chip structure connected by the fine-pitch solder bumps.
Besides, the fabrication of the present invention is relatively
simplified.