An apparatus for thermally processing a microelectronic workpiece
comprises a rotatable carousel assembly configured to support at least
one workpiece. A driver is coupled to the carousel assembly and rotates
the carousel assembly, moving the workpiece between a loading station, a
heating station and a cooling station. The loading, heating and cooling
stations are radially positioned about a center axis of the carousel
assembly. The heating station includes a heating element and an actuator
for moving the heating element into thermal engagement with the workpiece
in the heating station. The cooling station includes a cooling element
and an actuator for moving the cooling element into thermal engagement
with the workpiece in the cooling station. A process fluid distribution
manifold for delivering process fluid to the workpieces at each station
extends through a central opening in the carousel assembly. A
non-oxidizing gas is delivered through the manifold to create an oxygen
free environment during the thermal process.