An apparatus for transferring heat from a heat spreader is provided. The
apparatus includes a heat dissipating member and a heat spreading member
adjacent the heat dissipating member, the heat spreading member
configured to spread heat laterally across the heat dissipating member,
the heat spreading member defining a heat conduction plane. The apparatus
also includes a base adjacent to the heat spreading member, wherein the
heat spreading member is between the base and the heat dissipating
member, and at least one thermal via within the heat conduction plane,
the thermal via thermally coupled to the heat spreading member, the at
least one thermal via thermally coupled to the heat dissipating member
and the base through surface-to-surface contact.