According to one embodiment, an electronic apparatus comprising: a housing; a circuit board that is housed in the housing; a heat generation portion that is mounted on the circuit board; a heat radiation portion that is housed in the housing; a first conductor layer that is provided on the circuit board; a heat reception portion that is thermally connected to the heat generation portion; a heat pipe that is fixed to the first conductor layer; and a fixing member that mounts the heat reception portion on the circuit board, wherein the heat pipe includes a first end portion fixed to the heat reception portion, and a second end portion thermally connected to the heat radiation portion.