A method of mounting a speaker enclosure for a ceiling or wall mounted speaker which includes the selection of a flexible polymer speaker housing forming a hollow chamber having a speaker opening therein and being collapsible to a smaller size. A hole is cut into a building, ceiling or interior wall and a selected speaker housing is collapsed to a size to fit through the speaker opening in one side of a ceiling or wall. The collapsed flexible polymer speaker housing is then expanded on the other side of the ceiling or wall and attached to the ceiling or wall with an adhesive or the like adjacent the opening and a speaker attached to the ceiling or wall opening.