Provided is a flame retardant adhesive composition including (A) a
halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic
rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing
accelerator. Also provided are an adhesive sheet having a layer including
the above composition, and a protective layer for covering the layer
including the composition; a coverlay film having an electrically
insulating film, and a layer including the above composition provided on
top of the film; and a flexible copper-clad laminate having an
electrically insulating film, a layer including the above composition
provided on top of the film, and copper foil. Further provided are a
process for producing the adhesive sheet, a process for producing the
coverlay film, and a process for producing the flexible copper-clad
laminate. The halogen-free adhesive composition yields a cured product,
on curing, that exhibits excellent flame retardancy and electrical
characteristics (anti-migration properties). The composition can be used
for producing an adhesive sheet, a coverlay film, and a flexible
copper-clad laminate.