In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image pickup element as a semiconductor element is covered with a cover, and a holder as a lid is placed over the cover.

 
Web www.patentalert.com

< Semiconductor module with conductive element between chip packages

> Intrinsic thermal enhancement for FBGA package

> Semiconductor package

~ 00514