A package for microwave heating is provided. The package comprises a packaging film including an outer structural film having at least one set of perforations therethrough, and, an inner heat sealable film capable of being hermetically sealed to itself to form an inner package volume having no perforations therethrough that would create an aperture path through the packaging film. Typically, a non-release, heat and water stable, adhesive region is provided between the outer structural film and the inner heat sealable film. A packaging film, methods of formation of the packaging film, packages, and methods of use of the packages, are also described.