An indirect cooling liquid embedded package design for use with a computer
central processor unit is suitable for thermal management of high heat
dissipation electronic components such as server processors. The indirect
contact cooling liquid embedded packaged CPU has mechanical coupling and
embedded plumbing that attaches to the board pumped liquid supply and
indirect cooling of the heat-generating portion of the CPU with an
embedded microchannel heat exchanger. The coolant package system for the
CPU removes higher levels of heat indirectly from the core of the
processors by convective cooling. Cooling liquid is introduced into the
package of the server CPU by mechanically attaching the CPU to the board
through a socket interconnect. Pins of the socket serves to provide
electrical connection between the board and the CPU, while a few pins are
designed for the purpose of inletting and outletting cooling liquid into
and out of the CPU package.