A flexible insulating base, a plurality of conductor wirings aligned on
the flexible insulating base, and bump electrodes provided respectively
in end portions of the plurality of conductor wirings in a region where a
semiconductor chip is to be placed are provided. The semiconductor chip
is mounted on the conductor wirings by bonding electrode pads formed on
the semiconductor chip to the bump electrodes. An auxiliary conductor
wiring formed similarly to the conductor wirings is provided on the
insulating base, and an auxiliary bump electrode formed similarly to the
bump electrodes is provided on the auxiliary conductor wiring, so that
the electrode pads formed on the semiconductor chip can be registered
with respect to the bump electrodes on the conductor wirings by
positioning the semiconductor chip with reference to the auxiliary bump
electrode. It is possible to configure a wiring board having register
marks capable of positioning electrode pads of a semiconductor chip with
respect to bump electrodes with high accuracy.