A method of disassembling at least a portion of a structure that includes parts which are bonded together. The method includes selecting a subsurface depth within the structure at which it is desired to cause debonding of the structure. A laser beam diameter, pulse width and power level predetermined to produce a peak tensile stress within the structure at the selected depth are selected. A laser having the selected beam diameter is used to apply a shock load at the selected pulse width and power level to the structure. Using this method, damaged or unwanted aircraft skin, patches or overlays on structure can be removed more cleanly and simply than milling, grinding or other mechanical methods.