An integrated circuit package, according to one embodiment, includes a package substrate, an interface stratum and an integrated circuit die. Both the IC die and interface stratum are disposed on the package substrate. The integrated circuit die includes a microelectronic circuit having a plurality of inputs and outputs. A first set of the inputs and outputs are electrically coupled to a plurality of package-to-circuit connection regions on the package substrate. A second set of input and outputs are electrically coupled through the package substrate to package-to-circuit connection regions on the interface stratum.