A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.