A method for the production of an encapsulated and at least partly organic electronic device wherein the device comprises a combination of three groups of different electronic units or components which may be separate discrete structures arranged to be produced independently from one another electrically conductively interconnected, the groups including inorganic units, passive units and active units or active components such as antennae, diodes (rectifier diodes and/or light-emitting diodes), some of which units may be organic, e.g., organic transistors, and so on, and forming a resulting optimized circuit. The components of the three groups of units forming the resulting circuit are combined on a one piece flexible substrate film which can also serve as an encapsulation layer for the device.