In a printed wiring board 10, an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first part 52a is not in contact with the capacitor portion 40, passes through an upper electrode connecting portion third part 52c provided at the upper portion of the capacitor portion 40, and then connects from the upper electrode connecting portion second part 52b to an upper electrode 42. Furthermore, a lower electrode connecting portion 51 penetrates through the capacitor portion 40 in top to bottom direction so that it is not in contact with the upper electrode 42 of the capacitor portion 40, but is in contact with a lower electrode 41. Therefore, the upper electrode connecting portion 52 and the lower electrode connecting portion 51 can be formed even after in process of build-up, the whole surface is covered by a high dielectric capacitor sheet that has a structure that a high dielectric layer is sandwiched between two metal foils and will afterwards serve as the capacitor portion 40.