In some aspects, a method is provided for enhancing electronic device manufacturing throughput within an electronic device manufacturing tool. The method includes the steps of (1) for the electronic device manufacturing tool, creating an electronic device manufacturing schedule based on process factors and mechanical factors associated with the manufacturing tool; and (2) employing the electronic device manufacturing schedule during electronic device manufacturing within the electronic device manufacturing tool. Numerous other aspects are provided.

 
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> Semiconductor device with epitaxial C49-titanium silicide (TiSi.sub.2) layer and method for fabricating the same

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