A method of forming a three-dimensional stacked optical device includes forming a communication path on a transparent substrate and mounting at least one optical device to the communication path. The optical device includes a first surface, coupled to the transparent substrate that extends to a second surface. The method further includes embedding the at least one optical device in an insulating layer including a first surface, abutting the transparent substrate, extending to a second surface, and forming a communication path between the first surface of the optical device and the second surface of the insulating layer. The method also includes mounting an electronic chip to the second surface of the insulating layer. The electronic chip is coupled to the communication path so as to form a three-dimensional stacked optical device.