A method for applying anti-stiction material to a micro device on a substrate includes introducing anti-stiction material on a surface of an encapsulation device or a surface of the substrate and sealing at least a portion of the encapsulation device to the surface of the substrate to form a chamber to encapsulate the micro device and the anti-stiction material. The micro device includes a first component and a second component. The first component is moveable and is configured to contact the second component. The method also includes vaporizing the anti-stiction material and depositing the anti-stiction material on a surface of the first component or a surface of the second component after vaporizing the anti-stiction material to prevent stiction between the first component and the second component.