A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the flanges are embedded into the surface of the prepreg, creating via holes in the laminate that are substantially concentric with the individual flanges, plating the via holes with copper, chemically or mechanically milling off a portion of the copper plating and optionally some of the copper foil to reduce the overall thickness of the laminate, and laminating a second and optionally a third prepreg to the laminate. The resulting printed circuit board has the flanges embedded in the surface of the laminate so that the inside wall of the flange is electrically and mechanically attached to the outside wall of the plated through hole barrel.