An embodiment of the present invention relates to a alignment measurement system for measuring alignment between a plurality of chips of a device, the chips being assembled in a three-dimensional stacking configuration and equipped with at least an integrated capacitive sensor, including a multiple-capacitor structure integrated in the capacitive sensor, at least a sensing circuit connected to the multiple-capacitor structure which issues an output voltage, proportional to a variation of a capacitive value of the multiple-capacitor structure of the integrated capacitive sensor of the device and corresponding to a measured misalignment between the chips of the device.

 
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