A method for inspecting semiconductor wafers and the like is presented. The method comprises initially determining a baseline greyscale difference, such as a greyscale plot or greyscale visual representation, for at least one baseline semiconductor wafer subjected to a process. The baseline greyscale difference represents a numerical difference between composite preprocessing and postprocessing greyscale representations of all pixels on the baseline semiconductor wafer. The method further comprises determining a preprocess greyscale representation for one wafer in the semiconductor wafer set and subjecting the one wafer in the semiconductor wafer set to the process, determining a postprocess greyscale representation of the one wafer in the semiconductor wafer set, and determining a difference for the one wafer in the semiconductor set. The difference represents any disparity between preprocess and postprocess greyscale representations of the one wafer in the semiconductor set. The method then compares the difference to the baseline greyscale difference.