A method for manufacturing a heat pipe cooling device. The heat pipe
cooling device includes a U-shaped heat pipe, which is embedded within a
heat conductor. The heat conductor includes a rectangular base and an
upper cover connected to the base. The base includes many retaining
grooves which allow the absorption end of the heat pipe to be disposed
therein. The upper cover includes many through holes formed thereon
corresponding to the cooling end of the heat pipe. The bottom surface
includes many protrusive portions corresponding to the inner side of the
absorption end of the heat pipe. Furthermore, the upper cover and the
base both include a positioning portion for engaging each other. In this
manner, the upper cover is pressed on the cooling end of the heat pipe.
The protrusive portion will push the heat pipe to tightly contact with
the base. Finally, a planarization process is performed, thereby making
the bottom surface of the absorption end and the bottom surface of the
heat conductor to form a flat surface.