A power semiconductor module has a heat-dissipation contact surface (16)
for a thermally conductive connection to a cooling element (17). The
module can be simply, cost-effectively and reliably fixed to the cooling
element for the conduction of heat to the latter by at least one pressure
element (18, 19) which is permanently connected to the power
semiconductor module. When mounted, the pressure element (18) presses the
heat-dissipation contact surface (16) against the cooling element (17).