Apparatus and method for performing a verification buy-off operation
during an assembly manufacturing process, such as during printed circuit
board (PCB) manufacturing. A processing device is configured to establish
contact between a probe assembly and a first component of an assembly
having a plurality of components loaded in predetermined positions but
not yet electrically intercoupled, and to receive from the probe assembly
a component value associated with the first component. Preferably, the
processing device further determines whether the received component value
is within a predetermined specification. The processing device preferably
directs a user via a graphical user interface (GUI) to manipulate the
probe assembly to a position proximate the first component. The GUI
preferably provides a graphical representation of the assembly and a
marker that identifies the location of the first component thereon. All
of the components of the assembly are preferably verified individually
prior to a full production run.