Apparatus and method for performing a verification buy-off operation during an assembly manufacturing process, such as during printed circuit board (PCB) manufacturing. A processing device is configured to establish contact between a probe assembly and a first component of an assembly having a plurality of components loaded in predetermined positions but not yet electrically intercoupled, and to receive from the probe assembly a component value associated with the first component. Preferably, the processing device further determines whether the received component value is within a predetermined specification. The processing device preferably directs a user via a graphical user interface (GUI) to manipulate the probe assembly to a position proximate the first component. The GUI preferably provides a graphical representation of the assembly and a marker that identifies the location of the first component thereon. All of the components of the assembly are preferably verified individually prior to a full production run.

 
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> MAGNETIC MEDIUM STACK ASSEMBLY FOR A DATA STORAGE AND RETRIEVAL SYSTEM

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