An apparatus for cooling electronics is disclosed. The apparatus generally
relates to heat sinks that are operatively connected to electronics
enclosures. The heat sinks may be part of the electronics enclosure, or
alternately they may be operatively connected to the electronics
enclosure. An enclosure preferably prevents solar radiation from striking
the surface of the heat sink. At the same time, the enclosure allows air
to flow over the heat sink, allowing heat to be dissipated.