An underfill composition includes a thermosetting resin and a thermally
cleavable component that releases sulfonic acid upon thermal activation.
The underfill composition is applied to flip-chip technology during
no-flow underfill mounting of the flip-chip to a mounting substrate. The
mounting substrate can be further mounted on a board. A process includes
formation of the underfill composition. A method includes assembly of the
underfill composition with the flip-chip, and further can include
assembly of the mounting substrate to a board. A computing system is also
included that uses the underfill composition.