The present disclosure suggests several systems and methods for batch
processing of microfeature workpieces, e.g., semiconductor wafers or the
like. One exemplary implementation provides a method of depositing a
reaction product on each of a batch of workpieces positioned in a process
chamber in a spaced-apart relationship. A first gas may be delivered to
an elongate first delivery conduit that includes a plurality of outlets
spaced along a length of the conduit. A first gas flow may be directed by
the outlets to flow into at least one of the process spaces between
adjacent workpieces along a first vector that is transverse to the
direction in which the workpieces are spaced. A second gas may be
delivered to an elongate second delivery conduit that also has outlets
spaced along its length. A second gas flow of the second gas may be
directed by the outlets to flow into the process spaces along a second
vector that is transverse to the first direction.