A method and apparatus for electroprocessing a substrate is provided. In
one embodiment, a method for electroprocessing a substrate includes the
steps of biasing a first electrode to establish a first electroprocessing
zone between the electrode and the substrate, and biasing a second
electrode disposed radially inward of the first electrode with a bias
that is different than the bias applied to the first electrode. In one
embodiment, the first electrode is coated with an inert material and in
this way the same polish rate is obtained with a lower potential level
applied to the first electrode.