The casing of a power supply includes a bottom and a cover. Both of them
have a U-like shape. Since the cover is slightly wider than the bottom
two air ducts are provided between the side plates of the bottom and the
corresponding side plates of the cover respectively. A printed circuit
board is mounted within the casing, particularly on the bottom. Different
mechanical, electric and/or electronic components are mounted on the
printed circuit board. Furthermore, heat generating components are
mounted on the printed circuit board such that they are in right contact
with the side plates of the bottom. The waste heat generated by the
components is transferred to the side plates of the bottom and further on
to the cover and its side plates. From there the heat is dissipated into
the air and particularly into the air ducts from where it is dissipated
by the air flow from two fans that are arranged at the inlet of the air
ducts.