Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip into interconnection with respective protrusions of the cooling device extending through the circuit board to where the clip is disposed. In an assembled configuration, the clip biases the cooling device to a processing unit coupled to the circuit board on an opposite side from the clip.