The method for dicing a wafer including the steps of: reducing a thickness of a wafer to at least 0.1mm or less; forming a protection sheet tightly on one side of the wafer, the protection sheet having a Vickers hardness of 2 or more; and dicing the wafer by a grindstone, the wafer having the protection sheet thereon.

 
Web www.patentalert.com

< Adaptable food storage box

> Circuit board microwave filters

~ 00459