An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

 
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< Optical power distribution devices

> Apparatus for providing optical radiation

~ 00459