A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.