For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interface is thermally coupled to the component-side thermal interface to transfer the heat from the component-side thermal interface to a heat exchanger. A thermoelectric cooler (TEC) is thermally coupled in series with at least one of the component-side thermal interface and rack-side thermal interface. The TEC is operable to increase an amount of the heat transferred from the electronic device to the heat exchanger in response receiving an electrical input.