Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m.sup.2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising ozone (O.sub.3) in a solvent, where the solvent comprises acetic anhydride. The stripping solvent used to form the stripping solution may comprise a mixture of acetic anhydride with a co-solvent selected from the group consisting of a carbonate containing 2-4 carbon atoms, ethylene glycol diacetate, and combinations thereof. In some instances, the stripping solution may contain only acetic anhydride and ozone, where the ozone concentration is typically about 300 ppm or greater.