The invention relates to a Ni alloy anode material for Ni electroplating, which exhibits high plating yield. The Ni alloy anode material comprises a Ni alloy consisting essentially of high-purity Ni having purity of 99.99 mass % or higher and, as an alloy component, Si and Al in the following contents: Si: 30 to 300 ppm, and Al: 30 to 300 ppm.

 
Web www.patentalert.com

< Thermoelectric conversion of heat released during use of a power-plant or hydrogen storage material

> Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)

~ 00444