A molding method and apparatus includes movable die 30 and fixed die 20 which form cavity 50, and extrusion plate 40 movable in the die closing/opening direction. A die surface 32b corresponding to the undercut portion is formed by separate push-up block 32, which is fixed to push-up pin 42, which is tiltably held by extrusion plate 40, and passes through insertion hole 34 in movable die 30. A gap 34a enables push-up pin 42 to tilt in the insertion hole. Push-up block 32 releases the part from the movable die by relative movement between extrusion plate 40 and movable die 30, and, by further movement of the part, the slanted surface of the undercut portion pushes the die surface of the push-up block in a direction which intersects with the die closing/opening direction to free the undercut portion by tilting the push-up pin and push-up block.