Embodiments of this invention include active electrical components withing a housing that contains an absorptive cooler. The absorptive cooler is used to cool active electrical components, such as central processors or other heat-sensitive components. In some embodiments, heat produced by electronic components can be used to provide heat to the absorptive cooler. By using heat generated from within the housing of the electronic device or other heat-producing element to drive an absorptive cooler, temperatures within heat-sensitive elements, such as a central processing unit can be reduced with a minimum of energy loss, and thereby permitting faster processing speed and reduced power consumption.