A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.

 
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< Method and apparatus of fabricating a semiconductor device by back grinding and dicing

> Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
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