Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.