Disclosed is a lighting device with flipped side-structure of LEDs, which
allows emitted lights to travel in parallel with the mounting surface.
Single or plural LED chips are mounted on a substrate with their side
surfaces facing the substrate surface. The lighting device can be further
combined with optical protrusions on the substrate to form a light module
for reflecting and mixing lights emitted from the LED chips. It does not
require a conventional wire bonding process. The packaging structure also
resolves the heat dissipation problem of the LEDs. Electrostatic
discharge protection circuits can be included in the light module if
desired. The invention achieves good uniformity and high intensity of the
combined lights with desired chromaticity.