A wiring board includes: an insulating base; a plurality of conductive
wirings; and bumps formed on the conductive wirings, respectively. The
conductive wirings can be connected with electrode pads of a
semiconductor element via the bumps. The conductive wirings include a
connection terminal portion at an end portion opposite to the other end
portion where the bumps are formed, and at the connection terminal
portion, the conductive wirings can be connected with an external
component. The conductive wirings include first conductive wirings and
second conductive wirings, on which the bumps are formed respectively at
a semiconductor element mounting region. The first conductive wirings
extend from the bumps to the connection terminal portion. The second
conductive wirings extend beyond the semiconductor element mounting
region from the bumps but do not reach the connection terminal portion.
End portions of the second conductive wirings extending beyond the
semiconductor element mounting region are separated electrically from the
first conductive wirings by a cutting portion formed at a boundary region
with the first conductive wirings. Irrespective of the state of operating
electrode pads of a semiconductor element to be mounted, the bumps can be
arranged at constant intervals.