In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal driver chip mounted to a flexible substrate. The wires extending from the inner leads connected to the output terminals to the output outer leads do not need to travel around a liquid crystal driver chip. The flexible substrate can be scaled down. Yields can be increased.

 
Web www.patentalert.com

< Computer automated design system, a computer automated design method, and a semiconductor integrated circuit

> Optical device with alignment compensation

~ 00430