A heat dissipation device used for dissipating heat from heat generating
electronic components mounted on an interface card, which has a mounting
bracket for being mounted to a computer case, includes a heat-absorbing
member, a pair of heat pipes and a pair of heat-dissipating members. The
heat-absorbing member is bound to the heat generating electronic
components for absorbing heat generated by the electronic components. The
heat-dissipating members are disposed within the computer case and
located at one peripheral side edge of the graphics card. The
heat-absorbing member and the heat-dissipating members are connected by
the heat pipes so as to transfer the heat received by the heat-absorbing
member to the heat-dissipating members for further dissipating.