A printer apparatus is disclosed. The printer apparatus includes a heat
dissipation plate structure including a thermally conductive material,
and a processor comprising a major surface, where the processor generates
heat when energized, and where the heat dissipation plate structure is
coupled to the heat dissipation structure and is adapted to dissipate
heat from the processor. An array of pins is substantially perpendicular
to the major surface of the processor. The apparatus also includes a
socket assembly, and a circuit board, where the socket assembly is on the
circuit board. The pins in the array of pins are configured to be
received in the socket assembly. The apparatus also includes a memory for
storing print image data, the memory being operatively coupled to the
processor. It also includes a printing unit operatively coupled to the
memory for printing on paper.