A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

 
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< Semiconductor device and manufacturing method thereof

> Thin-film magnetic head having magnetic layers of different thicknesses and fabrication method for same

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