A heat sink for surface-mounted semiconductor devices is provided on a
superordinate circuit board of an electronic module. The heat sink
includes a three-dimensionally structured thermally conductive plate with
a press-on region and snap-action hooks. The snap-action hooks are
arranged approximately at right angles with respect to the press-on
region and are spring-elastically connected to the press-on region of the
heat sink via a spring-elastic connecting region of the heat sink. The
snap-action hooks engage with edge regions of a thermally conductive
coupling plate with the press-on region generating pressure. The coupling
plate is fixed to a rear side of a semiconductor chip of the
surface-mounted semiconductor device.