A temperature control system, which includes a miniature liquid-cooled
heat sink, is used to provide a controlled temperature surface to an
electronic device, such as a semiconductor device, during the testing or
burn-in phase. In one embodiment, the system includes a miniature
liquid-cooled heat sink device having a monolithic counter-flowing
structure. In other embodiments, the system includes a heater, a flow
control valve, a controller, and/or sensors.