A semiconductor power device includes a substrate of a first conductivity
type and an epitaxial layer of the first conductivity type over and in
contact with the substrate. A first trench extends into and terminates
within the epitaxial layer. A sinker trench extends from the top surface
of the epitaxial layer through the epitaxial layer and terminates within
the substrate. The sinker trench is laterally spaced from the first
trench, and is wider and extends deeper than the first trench. The sinker
trench is lined with an insulator only along the sinker trench sidewalls
so that a conductive material filling the sinker trench makes electrical
contact with the substrate along the bottom of the trench and makes
electrical contact with an interconnect layer along the top of the
trench.